Title

• Surface and subsurface integrity in ductile machining of semiconductor materials  
  Jiwang Yan

    1

• Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics  
  John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh

    65

• Ductile machining and high pressure phase transformations of semiconductor crystals  
  Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sérgio Pizani

    101

• Microstructural changes in silicon caused by indentation and machining  
  L C Zhang

    155

• MD simulation of semiconductor micromachining  
  Hiroaki Tanaka and Shoichi Shimada

    199

• Grinding of silicon wafers in the nano-technology era  
  Z.J. Pei, Z.C. Li and G. R. Fisher

    219

• Single-crystalline and poly-crystalline silicon wafer production using slurry wiresaw for wafer slicingwith micro-and nano-scale rolling-indenting  
  Sumeet Bhagavat and Imin Kao

    243

• Tribo-metrology of CMP  
  Norm V. Gitis

    271

• Semiconductor nanofabrication by combining nanoscale machining with wet etching  
  Noboru Morita and Noritaka Kawasegi

    297

• Laser machining of semiconductor devices  
  Maher S. Amer

    333